The wafer is dipped in the photoresist stripping solution and slowly tilted back and forth. This mild agitation ensures that photoresist is completely removed from the wafer.
After resist stripping, the wafer is rinsed in deionized water. Deionized water is very pure water, cleaned by reverse osmosis and ion exchange. This assures a chemically pure surface.
At the end of stripping, the mask pattern can be seen reproduced in the blue oxide.